C Series Reed Relay
The C Series is a compact, high-density surface-mount reed relay designed for high-frequency signal switching in space-constrained applications. With excellent internal shielding and RF performance up to 7 GHz, the C Series offers a 10% reduction in size compared to similar models, without compromising reliability or signal integrity.
Available in SPST-NO (Form A) configurations, the C Series supports coil voltages of 3.3 VDC and 5 VDC, and is rated for up to 10 W, 100 VDC, and 0.5 A. Its low-profile J-lead design makes it ideal for automated assembly and high-density PCB layouts in RF, telecommunications, and test systems. With long operational life and consistent performance, the C Series is a trusted solution for demanding high-speed applications.
- RF switching capability up to 7 GHz (standard 5 GHz)
- Compact surface-mount design with 10% smaller footprint than comparable models
- Excellent internal shielding for reduced signal interference
- SPST-NO (Form A) contact configuration
- Rated for 10 W, 100 VDC, and 0.5 A
- Coil voltage options: 3.3 VDC and 5 VDC
- J-lead package for high-density surface mounting
- Long product life and stable performance in RF environments
- RoHS compliant for global environmental standards
| Coil Voltage (VDC) | 3.3, 5 |
| Coil Resistance (Ω) Max. | 150 |
| Contact Form | 1A (SPST) Normally Open (N.O.) |
| Rated Power Max. | 10W/100VDC/0.5A |
| Insertion Loss -3dB drop off point GHz | ~ 5 GHz (7 GHz option) |
| Life Expectancy (at 1V 10mA) | > 300 Million Switching Cycles |
- Automated Test Equipment (ATE): High-frequency signal switching in load boards
- Telecommunications: RF routing in compact network modules
- Wireless Communications: Signal integrity in high-speed systems
- Functional PCB Test Systems: Reliable switching in dense test arrays
- Data Acquisition Systems: Precision signal control in compact instrumentation
- IC Wafer Testing: High-speed relay switching in semiconductor test setups