High density matrix reed relays are designed for ultra-compact, high-channel-count applications where space efficiency and performance are critical. With footprints as small as 4.35 × 4.35 mm, these relays enable dense relay arrays, up to 1000 relays on a 12” board, ideal for IC wafer testing, functional PCB test systems, and data acquisition platforms. Featuring low power consumption, fast switching speeds, and optional shielding configurations, they offer reliable performance in demanding environments. Their modular design supports vertical and horizontal stacking, making them a versatile solution for high-density signal routing and matrix switching.
